Faculty Directory

Moody, Jesse

Moody, Jesse

Assistant Professor
Electrical and Computer Engineering
2349 A. V. Williams
Website(s):

Dr. Jesse Moody is an Assistant Professor in the Department of Electrical and Computer Engineering at the University of Maryland. He is a researcher in RF integrated circuits (RFICs). His work covers microwave and millimeter-wave systems, resilient microelectronics, and developing systems leveraging advanced heterogeneous integration. He focuses on creating ultra-low-power, high-performance electronics for secure communications, sensing, and defense.

Before joining UMD, Dr. Moody was a Principal Member of Technical Staff at Sandia National Laboratories. There, he advanced RFIC and microwave technologies from early-stage concepts into deployable prototypes. His contributions earned him Sandia’s Young Innovator and Mission Innovator awards. He also received Best Industry Paper nominations at the IEEE RFIC Symposium in 2022 and 2023. Dr. Moody earned his Ph.D. in Electrical Engineering from the University of Virginia in 2020.

At Maryland, Dr. Moody directs the GHz-Circuits, Heterogeneous Integration, and Devices Lab (GHz-CHADs). His group develops new RFIC circuits and demonstrates them in real systems. The work emphasizes resilience and reliability in extreme environments. Students gain hands-on experience with the full research pipeline, from IC design and simulation to prototyping and technology transition.

Dr. Moody is dedicated to mentoring the next generation of engineers. His goal is to build resilient RFIC technologies that enable the future of communication and sensing systems. He is actively recruiting motivated students to join his lab.

  • RF and microwave circuit design

  • Millimeter-wave and sub-THz devices and systems

  • Ultra-low-power and energy-efficient integrated circuits

  • Nonlinear circuits and backscatter communications

  • Advanced frequency generation and amplification techniques

  • Antennas, arrays, and electromagnetic integration

  • 3D heterogeneous integration and advanced packaging

  • Resilient and high-reliability microelectronics

  • Low-SWaP sensing and communication architectures


J. Moody et al., "A −76dBm 7.4nW wakeup radio with automatic offset compensation," 2018 IEEE International Solid-State Circuits Conference - (ISSCC), San Francisco, CA, USA, 2018, pp. 452-454, doi: 10.1109/ISSCC.2018.8310379.

J. Moody et al., "Interference Robust Detector-First Near-Zero Power Wake-Up Receiver," in IEEE Journal of Solid-State Circuits, vol. 54, no. 8, pp. 2149-2162, Aug. 2019, doi: 10.1109/JSSC.2019.2912710. 

J. Moody, B. Magstadt, R. Costanzo, K. Tracey and T. Forbes, "A Near-Zero Power Reconfigurable and Robust Multiband RF Wake-Up Receiver Achieving −108dBm Sensitivity Operating from −40° C to 70° C," 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024, Washington, DC, USA, 2024, pp. 1061-1064, doi: 10.1109/IMS40175.2024.10600308.

J. Moody et al., "25.4 A Micromachined Heterogeneously Integrated Active-Probe Enabling Non-Disruptive In-Situ Measurements from DC to 50GHz," 2025 IEEE International Solid-State Circuits Conference (ISSCC), San Francisco, CA, USA, 2025, pp. 452-454, doi: 10.1109/ISSCC49661.2025.10904656.

J. Moody, S. Lepkowski and T. Forbes, "A mmW Receiver Exploiting Complementary Current Reuse and Power Efficient Bias Point," in IEEE Transactions on Microwave Theory and Techniques, vol. 72, no. 3, pp. 1706-1718, March 2024, doi: 10.1109/TMTT.2023.3308907. 

J. Moody, "A Double Balanced Frequency Doubler Achieving 70% Drain Efficiency and 25 % Total Efficiency," 2023 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), San Diego, CA, USA, 2023, pp. 157-160, doi: 10.1109/RFIC54547.2023.10186147.

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