Dr. Michael Osterman (Ph.D., University of Maryland, 1991) is a Senior Research Scientist and the director of the CALCE Electronic Products and System Consortium at the University of Maryland. He heads the development of simulation assisted reliability assessment software for CALCE and simulation approaches for estimating time to failure of electronic hardware under test and field conditions. Dr. Osterman served as a subject matter expert on phase I and II of the Lead-free Manhattan Project sponsored by Office of Naval Research in conjunction with the Joint Defense Manufacturing Technical Panel (JDMTP). He has consulted with automotive, medical, defense, and industrial electronic companies on the transition to lead-free materials. He organized and chaired the International Symposium on Tin Whiskers from 2007 to 2013. He has written eight book chapters and over 120 articles. He is a senior member of IEEE and a member of ASME, IMAPS and SMTA
Simulation assisted reliability assessment of electronic hardware
Solder interconnection fatigue testing and modeling
Corrosion testing for electronic equipment
Energy Based Modeling for Temperature Cycling Induced Tin Silver Copper Solder Interconnect Fatigue Life, Deng Yun Chen, Michael Osterman, and Abhijit Dasgupta; Microelectronics Reliability, April 2020, DOI: 10.1016/j.microrel.2020.113651.
Development of a Cycle Counting Algorithm with Temporal Parameters, James M. Twomey, Deng Y. Chen, Michael D. Osterman, and Michael G. Pecht; Microelectronics Reliability, April 2020, DOI: 10.1016/j.microrel.2020.113652
Experimental Approach to Determine Damage Curves for SnAgCu Solder Under Sequential Cyclic Loads , Elviz George, Deng Yun Chen, Michael Osterman, and Michael Pecht, Journal of Electronics Materials, Early Access, PP 1-9, 2019, DOI: 10.1007/s11664-019-07811-5.
Life Cycle Trends of Electronic Materials, Processes and Components, Chien-Ming Huang, Jose A. Romero, Michael Osterman, Diganta Das, and Michael Pecht, Microelectronics Reliability, Vol. 99, pp. 262-276, August, 2019 DOI: 10.1016/j.microrel.2019.05.023.